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Professors : Jung, Seung-Boo

Research keyword: Design and manufacture of electronic package component, Formulation of nanocomposite materials, Soldering and sintering of functional ink and paste by Intense pulse light energy, Transient liquid phase bonding process, Ultrasonic bonding, Soldering, flexible circuit, 3D package component, FSW(friction stir welding), Design and analysis of high RF component.