Micro System Packaging Lab
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Professors : Jung, Seung-Boo
Research keyword: Design and manufacture of electronic package component, Formulation of nanocomposite materials, Soldering and sintering of functional ink and paste by Intense pulse light energy, Transient liquid phase bonding process, Ultrasonic bonding, Soldering, flexible circuit, 3D package component, FSW(friction stir welding), Design and analysis of high RF component.관련링크
- 이전글Magnetic Materials Lab 21.04.15
- 다음글Multi-Functional Materials Processing Laboratory 21.04.15
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